ORION SYSTEMS INTEGRATION PTE. LTD.

Orion Systems Integration Pte. Ltd. designs and supplies high-throughput flip-chip bonding and semiconductor assembly equipment. Its PHOENIX QUADPRO platform and complementary systems target fine-pitch (10–100 µm) applications, MCM, Low-K materials, and handling of big/thin die and substrates. Orion delivers high UPH performance across machine classes (TCNCP up to 1,500 UPH @3 µm; TCCUF up to 2,000 UPH @3 µm; MTD up to 2,500 UPH @3 µm; STD FC up to 5,000 UPH @5 µm) and integrates features such as a 4-head bonding system, precision pre-bond die centering, built-in substrate fluxing, dip fluxing without cycle-time loss, and versatile thermal application modes. Optional high-speed dispensing supports up to 2,000 UPH @50 µm with volume precision of ±5%. Orion focuses on robust, high-speed packaging tools that combine throughput, accuracy, and process flexibility for advanced semiconductor assembly.