Our company specializes in the production of high-quality 12-inch wafer bumping and wafer level packaging services for the semiconductor industry. We utilize cutting-edge technology and equipment to ensure precise and reliable processing, meeting the demands of leading manufacturers worldwide.
Headquarters:
Singapore
Company Type:
SME
Company size:
51-200 Employees
Year Founded:
2005 (21 years)
Address:
391B ORCHARD ROAD, #21-06, NGEE ANN CITY, SINGAPORE 238874
Employees by Department
Key Decision Makers
Insight
- Operates in multiple countries
The company has corporate shareholder(s) or more than 20 individual shareholders
The company has a sophisticated ownership structure and may be part of a large corporate group
The company's annual budgeting is likely to take place between August - October
Financials
LOW
spending power
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Frequently Asked Questions (FAQ)
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