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ADVANPACK SOLUTIONS PTE LTD
Last Updated: 17 Jun 2026
Advanpack Solutions Pte Ltd provides breakthrough packaging technologies for semiconductors and integrated circuits. The company develops and commercializes Copper Pillar Bump and Molded Interconnect Substrate technologies and offers No-Flow Underfill and Flip-Chip packaging solutions. These technologies are deployed into semiconductors and integrated circuits for mobile devices. Advanpack operates in the semiconductor packaging industry with a focus on advanced IC packaging and interconnect innovations.
Country of registration | Singapore |
Registration number | 199700361Z |
Local SIC | |
Incorporation date | 17 Jan 1997 |
Company age | 29 years 5 months |
Official entity type | Private Limited Company |
No. of officers | 27 |
Contact
Address:
331 NORTH BRIDGE ROAD, #12-03, ODEON 331, Singapore 188720
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Associated business (1)
- ADVANPACK SOLUTIONS PTE LTDView MoreSingaporeAdvanpack Solutions Pte Ltd provides breakthrough packaging technologies for semiconductors and integrated circuits. The company develops and commercializes Copper Pillar Bump and Molded Interconnect Substrate technologies and offers No-Flow Underfill and Flip-Chip packaging solutions. These technologies are deployed into semiconductors and integrated circuits for mobile devices. Advanpack operates in the semiconductor packaging industry with a focus on advanced IC packaging and interconnect innovations.
This is the legal entity page of ADVANPACK SOLUTIONS PTE LTD. To access company info, company size, news, key maker's emails, visit the profile pages above.
Financials
Fiscal/Budgeting Period | October - December |
Auditor | HENG LEE SENG LLP |
Revenue | 1m - 5m |
Financial period end date | 31 Dec 2021 |
Share Capital - Ordinary shares | SGD 10,000,000 |
Last updated: 17 Jun 2026
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