Advanpack Solutions Pte Ltd provides breakthrough packaging technologies for semiconductors and integrated circuits. The company develops and commercializes Copper Pillar Bump and Molded Interconnect Substrate technologies and offers No-Flow Underfill and Flip-Chip packaging solutions. These technol...See more
Headquarters:
Singapore
Company Type:
SME
Company size:
1-10 Employees
Year Founded:
1997 (29 years)
Address:
331 NORTH BRIDGE ROAD, #12-03, ODEON 331, SINGAPORE 188720
Employees by Department
Key Decision Makers
Insight
The company has a sophisticated ownership structure and may be part of a large corporate group
The company's annual budgeting is likely to take place between October - December
Financials
LOW
spending power
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- SMEs in Singapore
- MNCs / Large Enterprises in Singapore
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